Program Overview

This doctoral program adheres to student-centered approach, guided by the improvement of original innovation and engineering practice abilities, and focuses on cultivating a group of high-level innovative talents and industry backbone in the field of modern electronic information with solid basic knowledge, high professional literacy, strong innovation and practical ability, a sense of mission, responsibility, and a good international perspective.

Research directions in this field: conductor heterojunction integration and advanced packaging, semiconductor manufacturing and processes, integrated circuit devices and design.

Core Courses

Modern Signal Processing, RF and mixed signal integrated circuit design, Optimization Theory and Applications, Modern Data Fusion Technology,Advanced Semiconductor Device Physics, etc.

Career Prospects

Industry, Postdoc, Research Institute, etc.

Consultation

Email:wangcy@szu.edu.cn                    

英文名

Junfa Mao

联系邮箱

jfmao@szu.edu.cn

中文简介

毛军发，中国科学院院士，深圳大学校长。曾担任上海交通大学副校长。1992 年于上海交通大学获博士学位。1994年-1996年在香港中文大学和美国加州大学伯克利分校各做了1年访问研究。主要研究高速与射频集成电路，以及智能感知技术。他是中国电子学会会士、微波分会主任委员，中国通信学会会士，IEEE Fellow，973首席，国家自然基金委杰出青年基金获得者、创新群体学术带头人以及基础科学中心项目负责人。发表论文500多篇，其中IEEE 刊物论文160多篇。先后获国家自然科学奖二等奖、国家技术发明奖二等奖、国家科技进步奖二等奖各 1 项，国家教学成果二等奖2项，负责的成果获2020年中国高等学校十大科技进展。

英文简介

Junfa Mao, CAS Academician, President of Shenzhen University. He was the Vice President of Shanghai Jiao Tong University. He received his Ph.D. degree from Shanghai Jiao Tong University in 1992. He was a Visiting Scholar at the Chinese University of Hong Kong (1994-1995) and the University of California, Berkeley (1995-1996). His main research interests include high-speed radio frequency integrated circuits and intelligent sensing technology. He is a fellow of the Chinese Institute of Electronics (CIE), the director of the Microwave Society of CIE, a fellow of the China Institute of Communications, IEEE Fellow, the Cheung Kong Scholar of the Ministry of Education, the Chief Scientist of the National Basic Research Program (973 Program) of China, a recipient of the National Science Fund for Distinguished Young Scholars, the Academic Leader of the Creative Research Groups of the National Natural Science Foundation of China and the Project Manager of the Fundamental Scientific Center.

He has authored or coauthored more than 500 papers (including more than 160 IEEE journal papers). He received the National Natural Science Award of China, the National Technology Invention Award of China, the National Science and Technology Advancement Award of China and two National Awards of Teaching. His research achievement was selected as one of Ten Major Scientific and Technological Progress of China's Colleges and Universities (2020).

英文名

Feng Rao

联系邮箱

fengrao@szu.edu.cn

中文简介

饶峰，特聘教授。主要研究领域为半导体信息功能材料与器件，研究方向包括（1）新型相变信息存储材料与器件、（2）外场作用下纳米材料行为原位表征、（3）非晶态半导体材料选通材料与器件、（4）二维与异质结薄膜材料与器件。已发表Science、Mater. Today、Nat. Commun.、Nano Lett.等第一/通讯作者论文70余篇；获中国授权专利40余项，美国专利5项。

英文简介

Prof. Feng Rao’s main research field is semiconductor informatic functional materials and devices, with research directions including (1) novel phase-change memory materials and devices, (2) in-situ characterization of nanomaterials behaviors under external stimuli, (3) amorphous semiconductor materials for selector applications, and (4) 2D and heterostructured film and devices. He has published over 70 peer reviewed articles, including some in prestigious journals, such as Science, Mater. Today, Nat. Commun., Nano Lett., etc, and also has been authorized over 40 Chinese and 5 US patents.

英文名

Mark Huang

联系邮箱

mark_huang@szu.edu.cn

中文简介

深圳孔雀A海外高层次人才（2019）， 深圳大学电子与信息工程学院和异质异构国家重点实验室特聘教授，微电子研究院封测中心主任（2021-）），宁波大学材化学院安中讲习教授（2018-2023），新加坡国立大学博士后（1996-1998），中国科学院化学研究所高分子化学博士（1996），在新加坡和美国工作18年，先后服务于日立化成（HCAP）任高级工程师，美光科技（Micron）任主任研究员，星科金朋（StatschipPAC）任高级经理，新加坡微电子研究所（IME）任技术顾问，瑞士SFS集团旗下Unisteel公司技术总监。2014回国加入硕贝德无线科技（SPEED）任CTO负责TSV制造和指纹模组封装技术开发。

专业特长：

①各种类型IC封装材料的应用和技术攻关；

②先进组装技术开发与商业化，包括封装倒装芯片（FCIP）、系统封装/多芯片模组（SiP/MCM）、晶圆级芯片封装（WLCSP），铜柱互连（Cu-Pillar），硅通孔（TSV）和扇出扳 级封装（FOPLP）；

③超薄晶片处理和成本可行的封装解决方案；

④技术创新，共发表论文50余篇，持有美国专利60项，新加坡专利2项，中国发明专利10项，实用新型专利32项。

研究兴趣: 高频高速新材料开发和应用，半导体封装技术(IC Assembly)，无线充电(WC)，物联网（IoT）和车联网（IoV）解决方案等。自2012年担任中国半导体国际技术大会委员会委员兼封装分会联席主席（Co-Chair）。

成功商业化案例：1. 在新加坡工作期间，带领研发团队成功开发全球首款PVD紧固件产品用于苹果手机5系列；2.开发性价比高的高阻隔密封材料可用于替代玻璃/陶瓷/金属的封装材料；

3.回国后开发全球首款硅通孔（TSV）指纹芯片工艺和新产品，用于华为手机。

英文简介

National Distinguished Expert (2016), Shenzhen Peacock Plan Overseas High-Level Talents (2019), Distinguished Professor at Shenzhen University, School of Electronics and Information Engineering, Director of the Assembly and Testing Center at the Microelectronics Research Institute (2021-), Guest Professor at the College of Materials and Chemistry, Ningbo University (2018-), Postdoctoral Research Fellow at the National University of Singapore (1996-1998), Ph.D. in Polymer Chemistry from the Institute of Chemistry, Chinese Academy of Sciences (1996). Worked in Singapore and the United States for 18 years, serving as a Senior Engineer at Hitachi Chemical Advanced Packaging (HCAP), Director of Research at Micron Technology, Senior Manager at StatschipPAC, Technical Consultant at the Institute of Microelectronics (IME) in Singapore, and Technical Director at Unisteel, a subsidiary of the Swiss SFS Group. Returned to China in 2014 and joined Supebed Wireless Technology (SPEED) as the CTO, responsible for TSV manufacturing and fingerprint module packaging technology development.

Areas of expertise:

l Application and technical research of various types of IC packaging materials.

l Development and commercialization of advanced assembly technologies, including Flip Chip in Package (FCIP), System-in-Package/Multi-Chip Module (SiP/MCM), Wafer-Level Chip-Scale Packaging (WLCSP), Copper Pillar Interconnect (Cu-Pillar), Through-Silicon Via (TSV), and Fan-Out Panel-Level Packaging (FOPLP).

l Ultra-thin wafer handling and cost-effective packaging solutions.

l Technological innovation, with over 72 published papers, 70 granted US patents, 2 Singapore patents, 10 Chinese invention patents, and 32 utility model patents.

Research interests:

l Development and application of high-frequency and high-speed new materials, semiconductor packaging technology (IC Assembly), wireless charging (WC), solutions for the Internet of Things (IoT) and the Internet of Vehicles (IoV). Since 2012, serving as a committee member and co-chair of the Packaging Subcommittee of the China Semiconductor International Technology Conference.

l Successful commercialization cases:

n During my tenure in Singapore, led a research and development team to successfully develop the world's first PVD fastener product for the Apple iPhone 5 series.

n Developed high-cost-performance barrier sealant materials as alternatives to glass/ceramic/metal packaging materials.

n After returning to China, developed the world's first TSV fingerprint chip process and new product for Huawei smartphones.

英文名

Sai-Wai Wong

联系邮箱

wsw@szu.edu.cn

中文简介

王世伟，男，香港人，2017年10月加盟深圳大学，任电子与信息工程学院长聘教授。2003年获香港科技大学电子工程本科学士学位，2003-2004分别在两家香港企业担任工程部主管。2005年和2009年分别获新加坡南洋理工大学硕士和博士学位，2009-2010年聘为新加坡科技研究家资讯通信研究院研究员，2010-2016年任华南理工大学副教授、硕导，2016-2017年任华南理工大学教授、博导。教育部新世纪优秀人才支持计划入选者（2013），2018年获深圳海外高层次人才孔雀C类人才，2014年IEEE高级会员。发表学术论文200余篇，谷歌引用超过4000次，H因子31，获授权发明专利超过60项，美国专利一项。主持国家自然科学基金项目和省市级项目多项。主要研究领域：微波电路与天线。

英文简介

Sai-Wai Wong received his B.S degree in electronic engineering from the Hong Kong University of Science and Technology, Hong Kong, in 2003, and the M.Sc. and Ph.D. degrees in communication engineering from Nanyang Technological University, Singapore, in 2006 and 2009, respectively. From Jul. 2003 to Jul. 2005, he was an Electronic Engineer to lead an electronic engineering department in China with two Hong Kong manufacturing companies. From May 2009 to Oct. 2010, he was a Research Fellow with the Institute for Infocomm Research, Singapore. Since November 2010, He was an Associate Professor and later bcome a Professor, in the School of Electronic and Information Engineering, South China University of Technology, Guangzhou, China. From Jul. 2016 to Sep. 2016, he is a Visiting Professor in City University of Hong Kong. Since 2017, He is a tenured Professor with the College of Electronics and Information Engineering, Shenzhen University, Shenzhen. His research interests include microwave/mmW/Terahertz circuit and antenna design. So far, he has authored and co-authored more than 200 papers in international journals and conference proceedings. His google paper citation is more than 4000 times. He holds more than 60 licensed Chinese invention patents and 1 USA patent. He has been serving as a reviewer for several top-tier journals such as IEEE TMTT, MWCL, AP and so on. He was the recipient of the New Century Excellent Talents in University awarded by the Ministry of Education of China in 2013. He is also the recipent of Overseas High-Caliber Personnal (Level C) in 2018.

英文名

Bin Liao

联系邮箱

binliao@szu.edu.cn

中文简介

廖斌，教授，新锐研究生导师，博士生导师，广东省智能信息处理重点实验室副主任。于2006年，2009年分别获得西安电子科技大学电子信息工程学士和信息与信息处理硕士学位，2013年获得香港大学电机与电子工程系博士学位。主要从事阵列信号处理，雷达信号处理、无线通信、通感一体化等研究。入选全球前2%顶尖科学家榜单，“终身科学影响力排行榜”，国家自然科学基金委员会与欧盟委员会“中欧人才项目”获得者，"广东特支计划" 科技创新青年拔尖人才，深圳大学优秀青年教师“荔园优青”，深圳市海外高层次人才（孔雀计划）B类，南山区“领航人才”B类获得者。获得教育部自然科学二等奖，第21届（北京）和第22届（伦敦）IEEE数字信号处理国际会议最佳论文奖，陕西省优秀毕业生，西安电子科技大学优秀毕业生，研究生优秀硕士学位论文特等奖，中国航天科技集团公司CASC一等奖学金等。主持10余项纵向科研项目，其中国家自然科学基金项目4项。在权威国际期刊和会议上发表论文150余篇。现为IEEE高级会员，IEEE 传感器阵列与多通道信号处理 （SAM）技术委员会委员，担任IEEE Transactions on Aerospace and Electronic Systems，Multidimensional Systems and Signal Processing（Springer），IET Signal Processing 等期刊副编辑（Associate Editor）。

英文简介

Bin Liao (Senior Member, IEEE) received the B.Eng. and M.Eng. degrees from Xidian University, Xi’an, China, in 2006 and 2009, respectively, and the Ph.D. degree from the University of Hong Kong, Hong Kong, in 2013. From 2013 to 2014, he was a Research Assistant with the Department of Electrical and Electronic Engineering, The University of Hong Kong, where he was also a Research Scientist with the Department of Electrical and Electronic Engineering from August to October 2016. From March to June 2023, he was a Visiting Professor with the Centre for Wireless Innovation (CWI), Queen’s University Belfast, U.K. He is currently a Full Professor with the College of Electronics and Information Engineering, Shenzhen University, Shenzhen, China. His research interests include sensor array processing, adaptive filtering, and convex optimization, with applications to radar, navigation, and communications. He was a recipient of the Best Paper Award in 2016 21st International Conference on Digital Signal Processing and 2017 22nd International Conference on Digital Signal Processing. He was a recipient of the National Natural Science Foundation of China and European Research Council (NSFC-ERC) programme. He is an Associate Editor of IEEE TRANSACTIONS ON AEROSPACE AND ELECTRONIC SYSTEMS, IET Signal Processing, and Multidimensional Systems and Signal Processing.

英文名

Zhaocheng Yang

联系邮箱

yangzhaocheng@szu.edu.cn

中文简介

阳召成，男，1984年生，博士，副教授，深圳大学新锐导师，军队三等功获得者，省优秀博士论文获得者，深圳市南山区“领航人才”，深圳市海外高层次“孔雀计划”人才。2007年6月和 2013 年6月分别获北京理工大学学士和国防科学技术大学信息与通信工程专业工学博士学位。2010年11月-2011年11月在University of York从事访问研究；2013年6月-2015年8月在国防科技大学任教，2015年9月-至今在深圳大学任教。在雷达领域从事科研工作15年多，其研究方向为智能感知雷达与信息处理，其技术涉及雷达信号处理、多传感器智能感知、阵列信号处理、稀疏表示、自动目标识别等。主持了国家、省多项自然科学基金、深圳市科技项目、企业合作横向项目等十余项，参与国家自然科学基金、973、863等项目多项。目前，撰写个人专著1本，获得/申请国家发明专利60余项。在国内外高水平学术期刊和会议上发表和录用学术论文90余篇，其中SCI检索40余篇，荣获2018年IET工程技术协会最佳论文奖。

英文简介

Zhaocheng Yang received the B.E. degree in information engineering from the Beijing Institute of Technology, Beijing, China, in 2007, and the Ph.D. degree in information and communication engineering from the National University of Defense Technology, Changsha, China, in 2013. From November 2010 to November 2011, he was a Visiting Scholar with the University of York, York, U.K. From June 2013 to August 2015, he was a Lecturer with the School of Electronics Science and Engineering, National University of Defense Technology. He is currently an Associate Professor with the College of Electronics and Information Engineering, Shenzhen University, Shenzhen, China. He served as the reviewer and the TPC member for many IEEE journals and conferences. His research interests include the area of array signal processing, adaptive signal processing, compressive sensing, machine learning, and edge intelligent sensing radar and its applications. He has published 1 book, more than 90 papers in journals/conferences and over 60 granted patents. He won the Excellent Doctoral Thesis of Hunan province, China, in 2015, and the IET Premium Awards for the best journal paper published in IET Signal Processing in 2018.